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PRELIMINARY PRODUCT INFORMATION
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8233TK
SiGe:C LOW NOISE AMPLIFIER FOR GPS/MOBILE COMMUNICATIONS
DESCRIPTION
The PC8233TK is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise amplifier for GPS and mobile communications. This device exhibits low noise figure and high power gain characteristics. This device is suitable for the reduction in power consumption of the mobile communication system because it operates by low voltage and low current. The package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process.
FEATURES
* Supply voltage * Low noise * High gain * Low current consumption * Built-in power-saving function * High-density surface mounting * Included protection circuits for ESD : VCC = 1.7 to 3.3 V (2.7 V TYP.) : NF = 0.90 dB TYP. @ VCC = 2.7 V, fin = 1575 MHz NF = 0.90 dB TYP. @ VCC = 1.8 V, fin = 1575 MHz : GP = 20 dB TYP. @ VCC = 2.7 V, fin = 1575 MHz GP = 19.5 dB TYP. @ VCC = 1.8 V, fin = 1575 MHz : ICC = 3.5 mA TYP. @ VCC = 2.7 V VPSon = 1.0V to Vcc VPSoff = 0.0 to 0.4V : 6-pin lead-less minimold package (1.5 x 1.1 x 0.55 mm)
* Included very robust bandgap regulator (Small VCC and TA dependence)
APPLICATION
* Low noise amplifier for GPS and mobile communications
ORDERING INFORMATION
Part Number Order Number Package 6-pin lead-less minimold (1511 PKG) (Pb-Free) Marking TBD Supplying Form * 8 mm wide embossed taping * Pin 1, 6 face the perforation side of the tape * Qty 5 kpcs/reel
PC8233TK-E2
PC8233TK-E2-A
Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC8233TK
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Document No. (1st edition) Date Published January 2007 NS CP(N)
(c) NEC Electronics Corporation 2007
PC8233TK
PIN CONNECTIONS
Pin No. 1 2 3 4 5 6 Pin Name INPUT GND Power Save OUTPUT GND VCC
INTERNAL BLOCK DIAGRAM
INPUT
1
6
VCC
GND
2
5
GND
Bias Power Save 3 4 OUTPUT
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Power-Saving Voltage Power Dissipation Operating Ambient Temperature Storage Temperature Input Power Symbol VCC VPS PD TA Tstg Pin Test Conditions TA = +25C TA = +25C TA = +85C Note Ratings 4.0 4.0 232 -40 to +85 -55 to +150 +10 Unit V V mW C C dBm
Note Mounted on double-side copper-clad 50 x 50 x 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter Supply Voltage Operating Ambient Temperature Power Save Turn-on Voltage Power Save Turn-off Voltage Symbol VCC TA VPSon VPSoff MIN. 1.7 -40 1.0 0 TYP. 2.7 +25 - - MAX. 3.3 +85 VCC 0.4 Unit V C V V
2
PC8233TK
ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = VPS = 2.7 V, fin = 1575 MHz, unless otherwise specified)
Parameter Circuit Current Symbol ICC No Signal Test Conditions (VPS = 2.7 V) MIN. 2.5 - 17.5 - fin1 = 1574 MHz, fin2 = 1575 MHz - TYP. 3.5 - 20 0.9 -7.5 MAX. 4.8 1 22.5 1.2 - - - - - Unit mA
At Power-Saving Mode (VPS = 0 V) Power Gain Noise Figure Input 3rd Order Distortion Intercept Point Input Return Loss Output Return Loss Isolation Gain 1 dB Compression Input Power RLin RLout ISL Pin (1 dB) GP NF IIP3 Pin = -35 dBm
A
dB dB dBm
7 8 - -
16 16 36 -23
dB dB dB dBm
STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25C, VCC = VPS = 1.8 V, fin = 1575 MHz, unless otherwise specified)
Parameter Circuit Current Symbol ICC No Signal Test Conditions (VPS = 1.8 V) Reference 3.3 - 19.5 0.9 fin1 = 1574 MHz, fin2 = 1575 MHz -8 Unit mA
At Power-Saving Mode (VPS = 0 V) Power Gain Noise Figure Input 3rd Order Distortion Intercept Point Input Return Loss Output Return Loss Isolation Gain 1 dB Compression Input Power RLin RLout ISL Pin (1 dB) GP NF IIP3 Pin = -35 dBm
A
dB dB dBm
16 15.5 36 -23.5
dB dB dB dBm
TEST CIRCUIT
22nF
8.2nH
IN
Vcc
1000pF
1.2pF
GND
GND
18nH
Power Save OUT
360
6.8nH
18pF
3
PC8233TK
PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm)
(Top View) (Bottom View)
0.480.05 0.480.05
1.50.1
1.10.1 1.30.05
0.20.1
0.160.05
0.90.1
4
0.550.03
0.11+0.1 -0.05
PC8233TK
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) Do not supply DC voltage to INPUT pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180 C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260
For soldering
Preheating temperature (package surface temperature) : 120C or below
Caution Do not use different soldering methods together (except for partial heating).
5
PC8233TK
6
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
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